In an effort to speed up the application of new production technology, Intel has agreed to invest the amount up to 4.1 billion for chip equipment maker ASML Holding NV (ASML) in the Netherlands.
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In particular, the investment by Intel with the goal of helping fund research and ASML has added 2 new technology development. First, Intel wants to accelerate the development of advanced technology to produce chips using ultraviolet (EUV) to create more powerful semiconductors. The second is companies want to help ASML converted a standard plate 450 mm wafer production as an alternative to the current standard of 300 mm to create a chip faster.
CEO Eric Meurice of ASML said, getting the amount of support from the Intel will help it can hire more engineers in developing new technologies faster, the figure expected about 1200 engineers.
By ASML, the airline can switch production technology of 450 mm wafer sheets as early as 2018. The factory plate wafer has higher price about 3-4 times the factory plate wafer 300 mm.
Intel CEO Brian Krzanich in an interview said there will be 2 technical transition occurs in huge ASML in the coming time, and production equipment for the chip will become a leading investment unit of Intel.
Known as Intel are very need to plate 450 mm wafer than ever before, by the transition to a new wafer technology will help the airline can lose 30-40% of the cost to produce chips, against their attacks from rivals, particularly AMD which had the advantage of the purchase price.
>> Bloomberg
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